MediaTek is developing a new chipset for mid-range smartphones

MediaTek is developing a new chipset for mid-range smartphones. MediaTek, the renowned chipmaker, recently made headlines with the announcement of its latest processor, the Dimensity 9200+ SoC, designed for high-end smartphones. However, it seems the company is not stopping there, as rumors hint at the impending launch of a new Dimensity 8300 chipset aimed at the mid-range device market. A new leak has provided some crucial details about its specifications.

According to the leak, shared by tipster Revengus on Twitter, the Dimensity 8300 SoC will boast a 1+3+4 architecture. This means it will have one Cortex X3 core operating at 2.8GHz, three Cortex A714 cores at 2.4GHz, and four Cortex A510 cores running at a clock speed of 1.6GHz. Moreover, this chipset will be coupled with an ARM Mali G52 MC6 GPU, boasting an 850MHz operating speed.

MediaTek is developing a new chipset for mid-range smartphones

The MediaTek Dimensity 8300 is expected to see the light of day later this year, likely taking its place just below the forthcoming flagship-grade Dimensity 9300. Considering the probable debut of the latter around November 2023, we can anticipate a similar timeline for the Dimensity 8300's announcement.

Drawing from past events, the Chinese smartphone manufacturer iQOO had revealed the Neo 7 SE model, featuring the Dimensity 8200 SoC, back in December 2022. This opens up the possibility that the company may equip its next-generation devices, potentially successors to the Neo 7 SE model, with the new Dimensity 8300. Stay tuned for more updates on this development. MediaTek is developing a new chipset for mid-range smartphones.

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