MediaTek introduced its new chip set, Dimensity 6100+

MediaTek, one of the biggest names in the mobile processor sector, introduced another chip set that will strengthen its hand in its competition with Qualcomm.

MediaTek introduced its new chip set, Dimensity 6100+

Earlier this year, MediaTek introduced the Dimensity 6020 and 6080, and has now added a new member to the 6000 series, the MediaTek Dimensity 6100+. Given that the 6080 was essentially a rebranding of the Dimensity 810 5G chipset, which targets the lower-midrange level, we can anticipate that the Dimensity 6100+ will be positioned similarly.

Differentiating itself from its predecessors, the Dimensity 6100+ SoC excels in power efficiency, a feat achieved through its 4nm-based manufacturing process. It supports vibrant displays, high frame rates, AI-enhanced camera technologies, lower power consumption, and dependable Sub-6 5G connectivity. To understand the distinctiveness of this chipset, it's important to dive into its specific features.

The Dimensity 6100+ SoC has an impressive suite of specifications. It includes an octa-core CPU with a maximum clock speed of 2.95 GHz Cortex-A78, complemented by the Arm Mali-G77 MC9 GPU for fluid graphics rendering. The SoC can handle a single camera of up to 200MP or three 64MP cameras thanks to its dual 14-bit ISP.

MediaTek introduced its new chip set, Dimensity 6100+

The SoC also provides immersive display experiences with refresh rates up to 144Hz for Full HD+ or 90Hz for Quad HD+. Connectivity options are extensive and include 5G Sub-6, Wi-Fi 6E, Bluetooth 5.3, GPS, and NFC. Storage capabilities can reach up to 1TB with UFS 3.1, and the SoC supports up to 16GB LPDDR5 RAM.

The Dimensity 6100+ SoC comes equipped with MediaTek HyperEngine 5.0 gaming technology to optimize gaming performance and deliver a smooth gaming experience. MediaTek's AI-powered camera technologies further enhance photography capabilities, providing advanced features and image enhancements.

Expected to make its debut in smartphones in the third quarter of 2023, the Dimensity 6100+ SoC aims to offer superior power efficiency, enhanced image processing, and improved AI performance to cost-effective and lower-mid-range devices.