Earlier this year, MediaTek introduced the Dimensity 6020 and 6080, and has now added a new member to the 6000 series, the MediaTek Dimensity 6100+. Given that the 6080 was essentially a rebranding of the Dimensity 810 5G chipset, which targets the lower-midrange level, we can anticipate that the Dimensity 6100+ will be positioned similarly.
Differentiating itself from its predecessors, the Dimensity 6100+ SoC excels in power efficiency, a feat achieved through its 4nm-based manufacturing process. It supports vibrant displays, high frame rates, AI-enhanced camera technologies, lower power consumption, and dependable Sub-6 5G connectivity. To understand the distinctiveness of this chipset, it's important to dive into its specific features.
The Dimensity 6100+ SoC has an impressive suite of specifications. It includes an octa-core CPU with a maximum clock speed of 2.95 GHz Cortex-A78, complemented by the Arm Mali-G77 MC9 GPU for fluid graphics rendering. The SoC can handle a single camera of up to 200MP or three 64MP cameras thanks to its dual 14-bit ISP.
MediaTek introduced its new chip set, Dimensity 6100+
The SoC also provides immersive display experiences with refresh rates up to 144Hz for Full HD+ or 90Hz for Quad HD+. Connectivity options are extensive and include 5G Sub-6, Wi-Fi 6E, Bluetooth 5.3, GPS, and NFC. Storage capabilities can reach up to 1TB with UFS 3.1, and the SoC supports up to 16GB LPDDR5 RAM.
The Dimensity 6100+ SoC comes equipped with MediaTek HyperEngine 5.0 gaming technology to optimize gaming performance and deliver a smooth gaming experience. MediaTek's AI-powered camera technologies further enhance photography capabilities, providing advanced features and image enhancements.
Expected to make its debut in smartphones in the third quarter of 2023, the Dimensity 6100+ SoC aims to offer superior power efficiency, enhanced image processing, and improved AI performance to cost-effective and lower-mid-range devices.