Anticipation is building for the imminent launch of the Redmi K70 series, expected by the end of this month. Recently, the standard K70 model was revealed in a leaked render, providing a clear glimpse of the device. With numerous leaks already surfacing, the latest details come from the Geekbench benchmarking platform, revealing key hardware aspects of the Redmi K70.
Spotted on Geekbench under the model number 2311DRK48C, the Redmi K70's database listing includes a motherboard codenamed ‘duchamp’. This motherboard is equipped with a processor configuration comprising four cores at 2.20GHz, three cores at 3.20GHz, and a prime core at 3.35GHz. This setup strongly indicates that the Redmi K70 will be powered by MediaTek’s Dimensity 8300 chipset, which is also set to be announced later this month. The Geekbench platform reveals that the smartphone will feature 16GB of RAM and come pre-loaded with Android 14 OS.
Redmi K70 spotted on Geekbench with key details
In terms of performance, the Redmi K70 scored 1,248 and 4,177 points in Geekbench’s single-core and multi-core test results, respectively. Furthermore, the same model number was previously listed on China’s 3C certification website, unveiling the phone's support for 90W fast charging and 5G connectivity. The smartphone is anticipated to be equipped with a 5,000mAh battery.
The leaked render of the Redmi K70 showcases a POCO-like rectangular camera island housing three cameras and an LED flash unit that protrudes notably. The device also features a flat display with a center-aligned punch-hole cutout and slim bezels around the screen, adding to its aesthetic appeal.
With these details in hand, the Redmi K70 series is shaping up to be a significant addition to Redmi’s smartphone lineup, offering a blend of robust hardware specifications and modern design elements.